Huawei's Next Foldable Phone Reportedly Features New 5G Kirin Chip

A recent report has revealed key processor details for Huawei Technologies upcoming mid-range foldable smartphone, the Nova Flip S, suggesting the device will be powered by a new generation of 5G-capable Kirin chipsets. The leak indicates an incremental but significant upgrade aimed at strengthening the company's position in the competitive foldable market.

The information comes from a technology news outlet report published on October 3, 2025, which cited a prominent leaker on the Chinese social media platform Weibo. The details follow the recent appearance of the new foldable device on a certification website, confirming its development.

According to the report, the Nova Flip S is expected to feature either the Kirin 8020 or the Kirin 8030 processor. The Kirin 8020, which is also used in the Nova 14 Ultra, is described as a slightly lower-clocked version of the flagship Kirin 9020 chip found in the Mate 70 Pro. This would represent a notable performance improvement and introduce 5G connectivity to the Nova Flip series, which previously used the 4G-only Kirin 8000 processor.

While the specifications for the Kirin 8030 remain unknown, it is tipped as the more likely candidate for the new device and is expected to deliver enhanced performance over its predecessors. The continued development of its proprietary Kirin processors underscores Huawei's resilience in semiconductor design.

Beyond the chipset, the Nova Flip S is expected to retain a design similar to its predecessor, with potential updates limited to new color options and other internal components. The device will also likely ship with Huawei’s latest operating system, HarmonyOS 5.1.

The introduction of an advanced, self-developed 5G chip in a mid-range foldable device could allow Huawei to capture a larger share of the mainstream consumer market. This move is poised to intensify competition among smartphone manufacturers in the increasingly popular foldable segment.