Report: Huawei's Latest Kirin Chip Uses SMIC's 5nm-Class Process Technology
Recent media reports indicate that the latest smartphone processor from distinct Chinese tech giant Huawei has achieved a significant manufacturing breakthrough, utilizing a 5-nanometer (5nm) class process node despite ongoing restrictions on advanced lithography equipment.
According to a report published by Huawei Central on December 12, 2025, technical analysis confirms that the new Kirin 9030 chipset is fabricated using a process known as "N+3," developed by China’s largest chipmaker, Semiconductor Manufacturing International Corp.
The chipset is currently deployed in the company’s newly launched Mate 80 series. While Huawei did not officially disclose manufacturers or specifications at the launch, industry observers noted substantial performance gains. The report highlights that the Mate 80 Pro Max demonstrates an approximate 42% overall performance improvement compared to the previous generation Mate 70 Pro+, which utilized the Kirin 9020 chip built on an older 7nm-class node.
Citing a structural analysis conducted by TechInsights, the report explains that SMIC achieved this 5nm-class performance without access to Extreme Ultraviolet (EUV) lithography tools, which are currently restricted by international export controls. Instead, the fabrication process relies on Deep Ultraviolet (DUV) lithography combined with advanced multi-patterning techniques.
The report notes that while this approach unlocks 5nm capabilities, the reliance on DUV technology necessitates complex quadruple patterning, which typically results in higher production costs and potential scaling challenges compared to EUV solutions. As of now, neither Huawei nor SMIC has issued an official statement regarding the specific manufacturing details of the Kirin 9030.
This development marks a continued effort by China’s semiconductor industry to advance domestic chip manufacturing capabilities. However, the increased complexity of producing advanced nodes without EUV tools suggests that yield rates and cost efficiency remain critical factors for the long-term sustainability of such high-end processors.