China Reportedly Sets 80% Chip Self-Sufficiency Goal by 2030, Prioritising Domestic 7nm Tools and Stable 14nm Output
China is accelerating efforts to localise its semiconductor supply chain, with industry leaders said to be targeting 80% chip self-sufficiency by 2030 and pushing to validate fully domestically developed equipment for advanced manufacturing nodes, amid continued US export controls.
According to Nikkei’s report published on March 31, 2026, 13 executives from leading semiconductor-related companies have proposed a five-year roadmap aligned with the Chinese government’s 2026–2030 plan, which lists semiconductors as a strategic priority. The South China Morning Post also reported on March 31, 2026 that advanced packaging is emerging as a key lever for China to strengthen chip capabilities despite restrictions on cutting-edge tools.
Nikkei said the roadmap calls for building and testing production lines using fully domestically developed equipment for 7-nanometre chips, while also aiming to achieve stable 14-nanometre production. The plan comes from a relatively low baseline: Nikkei, citing sources, reported that China’s chip self-sufficiency rate—measured by the share of domestic supply provided by Chinese companies—was about 33% in 2024.
At Semicon China, equipment makers showcased progress aimed at narrowing key bottlenecks. Nikkei reported that Advanced Micro-Fabrication Equipment.China unveiled equipment for logic chips at the 5nm node and below. Chairman Gerald Yin said the company plans to lift the share of high-performance products it can supply in-house to more than 60% within five to ten years through continued technology development and acquisitions.
Nikkei also reported that NAURA Technology Group expanded its product lineup after a 2025 investment in Kingsemi, and introduced new products incorporating nanometre-level technologies.
Separately, the South China Morning Post highlighted advanced packaging as a potential route to performance gains when leading-edge lithography remains constrained. It cited Zheng Li, chief executive of JCET Group , as saying the industry is moving toward next-generation “atomic level packaging,” targeting surface roughness below 0.2nm, compared with roughly 5nm in current 2.5D packaging.
Even with rapid capacity buildout, Nikkei pointed to persistent gaps in photolithography and other critical equipment compared with overseas leaders. The outlet noted that global suppliers including ASML, Tokyo Electron and Canon exhibited at Semicon China, while US firms Applied Materials, Lam Research and KLA participated as sponsors.
Nikkei also cited Lily Feng, president of SEMI China, as projecting that China’s share of global mature-node production capacity could rise from 25% in 2024 to 42% by 2028—suggesting near-term momentum may concentrate in established technologies even as the country attempts to validate domestic toolchains for more advanced nodes.
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